If using peak performance for a short duration, heat dissipation is not a matter of concern because of the advanced power management.This section has some tips on how to save power, which may help reduce heat generation and other aspects of the software that may affect thermal management. It may be possible to enable/disable CPU cores dynamically if both the SoC and operating system support it, which saves power, thus generating less heat. Please see DVFS on Windows Embedded Compact for further information. It forces reduction of the system clock when it reaches certain temperatures, independent of DVFS.ĭVFS is disabled by default on WinCE. Thermal Throttling is a mechanism implemented in the operating system to preserve the integrity of the processor. A side-effect of power consumption optimization is that the system generates less heat in workloads that don't make full use of the CPU. Dynamic Voltage and Frequency Scaling (DVFS) and Thermal Throttling ĭynamic Voltage and Frequency Scaling (DVFS) is a mechanism in which the operating system optimizes power consumption by adjusting the CPU clocks and voltage based on demand. This section goes through the software and BSP specifics related to thermal management. Verdin iMX8M Plus Quad 2GB Wi-Fi / Bluetooth IT Verdin iMX8M Plus Quad 4GB Wi-Fi / Bluetooth IT Verdin iMX8M Mini DualLite 1GB Wi-Fi / Bluetooth IT Verdin iMX8M Mini Quad 2GB Wi-Fi / Bluetooth IT The dropdown tables below list the operating temperature range by Toradex SoM: Apalis Family Maximum Operating Temperature by Apalis SoM As a consequence, the most critical element regarding temperature limits may not be the SoC, but instead another part. The operating temperature of all the electrical components in an SoM defines the final module specification. Thermal Resistance Junction-to-Ambient (☌/W) This section goes through the hardware specifics related to thermal management. It goes through the hardware and software BSP specifics as well as cooling solutions. This article provides an overview of thermal management solutions applied to the Toradex system SoMs. Knowing the environment temperature range where the system will operate is essential for designing a thermal management solution that both satisfies the system requirements and uses the least complex cooling mechanism possible. Environment: heat flux intensity depends on a difference of temperature, which in our case is the difference between the hardware - usually the SoC in this case - and the environment.A low-power SoM may fit a constrained enclosing, whereas a high-performance system may require a well-designed airflow or ventilation scheme for proper operation. Enclosing: the mechanical enclosing of the system - a box, for instance - must be taken into account when it comes to thermal management.It is directly related to the use-case application but also affected by the BSP version and its fine-tuning. Software: the power consumption - and thus the heat generation - of the system and its components are affected by the software load put on the hardware components, such as CPU cores, GPU, and peripherals.The optimal design of the carrier board may help reduce the power consumption of the system, which may reflect on a significant heat reduction. Usually, one is concerned with the System on Chip (SoC) heat dissipation and the (System on Module) SoM operating temperature ranges. Also, each different component has its specific operating temperature ranges and limits. Hardware: the heat generation is directly proportional to the power consumption of the device.It involves concepts such as power consumption, heat dissipation, and system temperature, which are related to the following topics: Thermal management is the area concerned with making sure that the system and its components operate within defined temperature ranges, to guarantee the reliable operation of the whole system. Is this page helpful? Thermal Management Introduction
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